Manufacturing a white LED, comprises preparing a reflector cup, mounting LED chip on a bottom surface of the reflector cup, and forming a molding compound in the reflector cup such that the LED

Автор(и): 
SHYLO S, IK S D, SHIN D I
Публікація: 
N 8,390,189
Рік: 
2013
Країна: 
USA
Підрозділ: 
Кафедра математики, теоретичної фізики і комп-рних технологій
Manufacturing a white LED, comprises preparing a reflector cup, mounting LED chip on a bottom surface of the reflector cup, and forming a molding compound in the reflector cup such that the LED chip is surrounded by the molding compound
Patent Number(s): US2012122255-A1 ; US8390189-B2
Inventor(s): SHYLO SIK S DSHIN D I
Patent Assignee Name(s) and Code(s): SAMSUNG LED CO LTD(SMSU-C)
SAMSUNG ELECTRONICS CO LTD(SMSU-C)
Derwent Primary Accession Number: 2012-F70783 [28]
Patents Cited by Examiner: 7 Articles Cited by Examiner: 2
Abstract: NOVELTY - The method comprises preparing a reflector cup (120), mounting an LED chip (110) on a bottom surface of the reflector cup, forming a molding compound (130) in the reflector cup such that the LED chip is surrounded by the molding compound, forming a phosphor layer (150) on the molding compound, forming a light transmitting layer (160) by inserting spherical particles into the phosphor layer such that an embossing pattern is formed on a surface of the phosphor layer, and completely curing the phosphor layer after the spherical particles are inserted into the phosphor layer.

USE - The method is useful for manufacturing a white LED, which is useful as a display device and a backlight unit.

ADVANTAGE - The method is capable of easily and rapidly manufacturing the white LED with long lifespan, less power consumption, enhanced light extraction efficiency and increased vibration resistance.

DETAILED DESCRIPTION - The method comprises preparing a reflector cup (120), mounting an LED chip (110) on a bottom surface of the reflector cup, forming a molding compound (130) in the reflector cup such that the LED chip is surrounded by the molding compound, forming a phosphor layer (150) on the molding compound, forming a light transmitting layer (160) by inserting spherical particles into the phosphor layer such that an embossing pattern is formed on a surface of the phosphor layer, and completely curing the phosphor layer after the spherical particles are inserted into the phosphor layer. The step of forming the phosphor layer includes mixing transparent resin with phosphor materials, dispensing the transparent resin and the phosphor materials on the molding compound, and semi-curing the transparent resin and the phosphor materials dispensed on the molding compound. The step of forming the light transmitting layer includes semi-curing the phosphor layer, preparing a container in which spherical-particle powder is stored, preparing a support bar having a sheet for bonding the spherical-particle powder, putting the sheet into the container such that the spherical-particle powder is bonded to the surface of the sheet, placing the sheet having the spherical-particle powder bonded on the sheet onto the semi-cured phosphor layer, applying pressure to insert the spherical particles into the phosphor layer, and separating the support bar from the phosphor layer. The sheet is attached to the lower surface of the support bar. The spherical particles have diameter of 5-100 mu m. A ratio of a radius of the spherical particles to a height of the embossing pattern from the surface of the phosphor layer is 0.6:1.

DESCRIPTION OF DRAWING(S) - The figure shows a process diagram of a method of manufacturing a white LED.

LED chip (110)

Reflector cup (120)

Molding compound (130)

Phosphor layer (150)

Light transmitting layer. (160)

Technology Focus/Extension Abstract: TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The molding compound is formed of poly(methyl methacrylate), polystyrene, polyurethane, benzoguanamine resin, epoxy and silicon resin.
 

Show Documentation Abstract 
Drawing: 
International Patent Classification: H01L-033/60
Derwent Class Code(s): A85 (Electrical applications); L03 (Electro-(in)organic, chemical features of electrical devices); U12 (Discrete Devices, e.g. LEDs, photovoltaic cells)
Derwent Manual Code(s): A11-C04; A12-E11A; L04-C06; L04-C17; L04-E03A; U12-A01A2; U12-A01A4A; U12-A01A7
Patent Details:
Patent Number Publ. Date Main IPC Week Page Count Language
US2012122255-A1  17 May 2012 H01L-033/60 201235  Pages: 14  English 
US8390189-B2  05 Mar 2013 H01L-033/60 201318    English 
Application Details:
US2012122255-A1  US354837  20 Jan 2012
US8390189-B2  US354837  20 Jan 2012
Further Application Details:
US2012122255-A1  Div ex  Application  US068998 
US8390189-B2  Div ex  Application  US068998 
Priority Application Information and Date:
KR132469  17 Dec 2007 
 
Compound(s):
DCR Number Role DCR Number Role DCR Number Role
133150-0-0-0 () 368-0-0-0 () 7200-0-0-0 ()
Derwent Compound Number(s):
Compound Number Role Compound Number Role Compound Number Role
R15286 () R00708 () R00479 ()
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Дизайн: Інститут високих технологій
Ivan Ivanov